Ramon公司的RC多核心处理器可以与64位的CEVA-X1643DSP集成，这种解决方案可以大大提升并行处理能力，可以被广泛的应用在卫星通信领域、探测及科学探索应用领域。
据2015年5月19日MOUNTAIN VIEW报道，全球DSP主要生产商CEVA公司与Ramon Chip公司宣布合作，双方将致力于开发用于空间应用的具有抗辐照工艺的ASIC设计解决方案，目前已有的方案就是集成在RC64 64核心并行处理器中的CEVA-X1643的解决方案，主要面向高要求和高保障的空间应用领域。Ramon在RC64处理器中集成了64位CEVA-X1643 DSP核，这种方案可以大大提升运算性能，对于下一代卫星通信、地球观测以及科学研究或其他应用都将会有重要影响，成为核心技术。
RC64 是 65nm CMOS工艺 并行处理器，提供 384 GOP、 38 GFLOPS和 60 Gbps 的数据速率。每个 64 CEVA-X 1643 芯有直接访问 4 MB 共享内存，除了专用内存和缓存，包括支持 ECC。核心在运行时被并行任务的硬件同步器自动管理，有利几乎完美的实现核芯之间动态负载平衡，提高任务交换效率并降低延迟时间。
Ramon Chip首席执行官 Prof. Ran Ginosar说：近二十年来底层处理器技术在卫星都没有改动大多，对于今天的处理密集型应用程序，导致性能不佳。我们新的 RC64 处理器基于 CEVA-X 1643 DSP 承诺要改变这一瓶颈，杰出性能、 可编程性和可扩展性可满足下一代卫星系统，多类型最新的卫星通信、 研究和观测应用程序所需的大规模并行处理。
CEVA的营销副总裁Eran Briman说：很高兴能与Ramon Chip公司合作，共同致力于开发基于CEVA DSP核心的用在卫星上的最大规模的多核并行处理器RC64。其中大规模多核并行处理能力是高性能空间计算的关键，我们公司的CEVA-X1643性能可以满足Ramon Chip公司提出的这些苛刻的要求。
CEVA-X 1643 DSP 核心采用单指令多数据 (SIMD) 的处理能力可提供非常长的指令字 (VLIW)组合。其 32 位编程模型支持高度的并行性，包括每个周期可处理最多八个指令和每个周期 16 SIMD 操作的能力。它配备了高性能基于 AXI 的内存子系统，采用完全缓存的指令和数据记忆带 ECC，支持多核和众核架构设计，并包括Power Scaling Unit (PSU)，提供动态和漏电功耗的高级电源管理。有关详细信息，请访问 http://www.ceva-dsp.com/CEVA-X1643。
关于Ramon Chip公司的介绍
Ramon Chip公司是一家专注于空间应用领域具备抗辐照的VLSI/ASIC设计公司。公司经验证过的RadSafe™核心技术不仅在空间应用复杂环境下针对空间粒子效应具有很高免疫性和抗辐照性能，还具备很高的集成度，很高的性能，同时保持较低的功耗。公司参与了 2020 年地平线研究项目，包括 VHiSSI、 QI2S 和 MacSpace 。其他信息，请访问 www.ramon-chips.com。
Ramon Chips Licenses CEVA-X DSP for High Performance Computing for Space Applications
RC64 multi-core processor from Ramon integrates sixty-four CEVA-X1643 DSPs, enabling massively parallel processing for satellite communication, observation and science research applications
MOUNTAIN VIEW, Calif., May 19, 2015 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, today announced that Ramon Chips, Ltd., a fabless semiconductor company focused on developing unique Radiation Hardened ASIC solutions for space applications, has licensed the CEVA-X1643 for its RC64 64-core parallel processor, targeting high performance space computations. Ramon will integrate sixty-four CEVA-X1643 DSPs into the RC64 processor, delivering a huge leap in computational power for next-generation satellites deployed for communications, earth observation, science and many other applications.
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RC64 is a 65nm CMOS parallel processor, providing 384 GOPS, 38 GFLOPS and 60 Gbps data rate. Each of the 64 CEVA-X1643 cores has direct access to a 4MB shared memory, in addition to private memories and caches, including support for ECC. The cores are managed at runtime by a hardware synchronizer that automatically manages parallel tasks, enabling nearly-perfect dynamic load balancing among the cores and facilitates task switching at a very high rate and very low latency.
“The underlying processor technologies in satellites have remained mostly unchanged for nearly two decades, resulting in poor performance for today’s processing-intensive applications,” said Prof. Ran Ginosar, CEO at Ramon Chips. “Our new RC64 processor based on the CEVA-X1643 DSP promises to change this, bringing outstanding performance, programmability and scalability to next-generation satellite systems, and enabling the massively parallel processing required for many of the latest satellite communications, research and observation applications.”
“We are excited to work with Ramon Chips on the development of their RC64 64 DSP satellite processor, one of the largest multi-core use cases for our DSPs,” said Eran Briman, vice president of marketing at CEVA. “Massively parallel processing is key for high performance space computing and the CEVA-X1643 delivers exceptional capabilities for the demanding use cases that Ramon is targeting.”
The CEVA-X1643 DSP core, features a Very Long Instruction Word (VLIW) architecture combined with Single Instruction Multiple Data (SIMD) capabilities. Its 32-bit programming model supports a high degree of parallelism, including the ability to process up to eight instructions per cycle, and 16 SIMD operations per cycle. It is equipped with a high performance AXI-based memory sub-system, adopts fully-cached instruction and data memories with ECC, supports multi-core and many-core architectures, and includes an innovative Power Scaling Unit (PSU), which provides advanced power management for both dynamic and leakage power. For more information, visit http://www.ceva-dsp.com/CEVA-X1643.
About Ramon Chips
Ramon Chips is a fabless semiconductor company focused on developing unique Radiation Hardened VLSI /ASIC solutions for space applications. Our silicon proven RadSafe™ technology provides extreme high immunity to all space radiation effects in LEO, GEO and outer space missions, while maintaining high density, high performance and low power. The company participates in a number of Horizon 2020 research programs, including VHiSSI, QI2S and MacSpace. For additional information, visit www.ramon-chips.com.